Ohata Circuit Board Scrap Guideline
1. Introduction to Ohata PCB Scrap Classification
Use this guide to sort printed circuit board scrap into Ohata's nine grades: SS, S, A+, A, B, C, D, Appliance A, and Appliance B. Start with board type, then check CPU socket construction, integrated-circuit density, gold-plated contacts, and physical condition. The grade describes Ohata's recycling classification, not an industry-wide standard or a guaranteed purchase price. Use the comparison table for a first pass, then open the grade-specific pages for identification examples and acceptance details.
The Ohata Circuit Board Scrap Classification is SS Grade, S Grade, A+ Grade, A Grade, B Grade, C Grade, D Grade, Appliance A Grade and Appliance B Grade.
Printed circuit boards are found in nearly every modern electronic product, including Hard Disk Drive (HDD) Board, desktop computers, laptop computers, enterprise servers, telecommunications equipment, industrial automation systems, medical devices, networking hardware, gaming consoles, automotive electronics, and household appliances. Although these products may appear similar, the materials used in their construction vary significantly. Some boards contain extensive gold plating, dense integrated circuits, ceramic components, and high-grade connectors, while others contain relatively small amounts of recoverable precious metals.
Without a consistent classification guideline, determining the value of circuit board scrap becomes difficult. Different buyers may assign different grades to the same board, resulting in inconsistent pricing, inefficient sorting, and unnecessary confusion throughout the recycling supply chain. The Ohata Board Classification addresses these challenges by applying objective evaluation criteria based on measurable physical characteristics rather than subjective opinions or fluctuating market prices.
The Ohata methodology evaluates numerous factors, including integrated circuit density, gold-plated connectors, CPU socket design, PCB construction, surface finish, board complexity, manufacturer type, and intended industrial application. These factors collectively determine a board's classification and expected recycling value.
Unlike systems that focus only on computer motherboards, the Ohata Printed circuit boards Classification encompasses a broad range of electronic products, including telecommunications boards, industrial controllers, robotics equipment, programmable logic controllers (PLCs), medical electronics, military communication systems, networking hardware, graphics cards, hard drive controller boards, and appliance control boards. This comprehensive approach reflects the increasingly diverse nature of modern electronic waste.
Beyond supporting pricing decisions, the Ohata system serves as an educational and technical reference. It promotes consistent terminology, improves sorting accuracy, enhances operational efficiency, and supports responsible resource recovery. As electronic recycling continues to expand worldwide, the Ohata Board Scrap Classification Wiki aims to become a trusted knowledge base that combines practical identification guidance with grading principles, helping industry professionals identify, evaluate, and recycle printed circuit boards more accurately and efficiently.
2. History of Circuit Board Recycling
The history of printed circuit board recycling mirrors the rapid development of the global electronics industry. During the early decades of electronic manufacturing, most equipment relied on point-to-point wiring instead of printed circuit boards. As PCB technology became commercially viable in the 1950s and 1960s, manufacturers rapidly adopted it because it improved reliability, reduced production costs, and simplified assembly.
Initially, electronic products were expensive and often repaired rather than discarded. Obsolete equipment was commonly stored or reused, and organized electronic recycling was relatively uncommon. As personal computers, telecommunications equipment, industrial controllers, and consumer electronics became widely available during the 1970s and 1980s, the number of discarded circuit boards increased dramatically.
Early computer motherboards and telecommunications equipment often contained relatively large amounts of gold plating, ceramic processors, and socketed integrated circuits. These designs unintentionally created highly valuable electronic scrap because many of the materials used for reliability also possessed significant precious metal value.
During the 1990s and early 2000s, rapid technological innovation accelerated product replacement cycles. Desktop computers, laptops, mobile phones, gaming consoles, networking equipment, and industrial electronics were replaced more frequently, creating one of the world's fastest-growing waste streams. At the same time, advances in metallurgical processing enabled refiners to recover gold, silver, palladium, copper, and other valuable materials from electronic scrap more efficiently than ever before.
Environmental awareness further accelerated the growth of electronic recycling. Governments introduced regulations promoting responsible recycling, safe handling of hazardous materials, and recovery of valuable resources. Electronic recycling evolved into a sophisticated global industry supported by mechanical separation, hydrometallurgical processing, pyrometallurgical refining, and advanced material recovery technologies.
As the industry matured, one challenge became increasingly apparent: inconsistent terminology and grading practices. Similar boards were described differently by different buyers, creating confusion in international trade and pricing. These challenges highlighted the need for classification systems capable of evaluating boards according to objective technical characteristics rather than subjective descriptions.
The Ohata PCB Scrap Classification System represents the next stage in this evolution by providing a comprehensive methodology for identifying and grading electronic boards based on their construction, component density, precious metal content, and industrial application.
3. Why Board Classification Matters
Accurate board classification is fundamental to an efficient electronic recycling industry. Every circuit board contains a unique combination of electronic components, metals, and construction techniques that directly influence its recycling value. Without grading, buyers may overpay or underpay for materials, suppliers may receive inconsistent pricing, and refiners may encounter mixed loads that reduce recovery efficiency.
A classification system creates transparency throughout the supply chain. Sellers understand how their material is evaluated, buyers can establish consistent purchasing guide, and recyclers can process materials more efficiently. Proper classification also improves inventory management, shipping preparation, downstream refining, and quality control.
The Ohata Board Classification System promotes consistency by evaluating boards using objective characteristics such as integrated circuit density, gold-plated connectors, CPU socket type, board complexity, and intended industrial application. This approach reduces subjectivity while supporting fair pricing, operational efficiency, and responsible recycling practices.
4. Precious Metals Found in Circuit Boards
Printed circuit boards are valuable because they contain concentrated amounts of recoverable metals used to ensure electrical conductivity, corrosion resistance, heat management, and long-term reliability. Although the exact composition varies by manufacturer, application, and production period, most circuit boards contain a combination of base metals and precious metals that contribute to their recycling value.
Gold is the most recognized precious metal used in electronic equipment. Manufacturers commonly apply gold plating to edge connectors, CPU contacts, memory sockets, telecommunications connectors, and integrated circuit bonding wires because gold resists oxidation while maintaining excellent electrical conductivity. Boards with long gold fingers, gold-plated pins, or numerous gold bond wire integrated circuits generally possess higher recycling value.
Silver is widely used in solder alloys, thick-film conductors, switches, and electrical contacts. Although less visible than gold, silver contributes significantly to the overall recoverable value of many industrial and telecommunications boards.
Palladium is frequently found in multilayer ceramic capacitors, specialized connectors, and high-performance electronic assemblies. Palladium provides excellent corrosion resistance and electrical stability, making it valuable for advanced electronic applications.
Copper represents the largest recoverable metal by weight in most printed circuit boards. Copper forms conductive traces, power planes, internal PCB layers, transformers, coils, and wiring. High-layer-count boards typically contain greater copper content than simpler consumer electronics.
Additional recoverable materials include nickel, tin, aluminum, steel, and, in specialized applications, trace amounts of platinum-group metals. The concentration of these materials depends on board complexity, manufacturing technology, intended industry, and performance requirements.
Understanding the distribution of these metals is essential when evaluating circuit board scrap. Boards designed for enterprise networking, telecommunications, military communications, industrial automation, or aerospace applications generally contain higher-quality components and greater concentrations of valuable materials than low-cost consumer electronics. The Ohata Classification System considers these characteristics when assigning board grades, ensuring that material value reflects both physical construction and expected precious metal recovery potential.
5. The Ohata PCB Scrap Classification Principle
The Ohata Board Scrap Classification is founded on the principle that every printed circuit board should be evaluated using objective, repeatable, and technically meaningful criteria rather than subjective opinions or temporary market fluctuations. The purpose is to establish a consistent internal and public identification framework for Ohata purchasing, sorting and educational use.
Unlike traditional grading methods that rely primarily on board size or general appearance, the Ohata methodology considers the complete construction of a circuit board. Each board is evaluated according to several key factors, including integrated circuit (IC) density, CPU socket type, gold finger quality, gold-plated connectors, gold bond wire chips, component complexity, PCB construction, surface finish, industry application, and overall recoverable precious metal value. By combining these technical characteristics, the system provides a more accurate assessment of recycling potential.
Another guiding principle is that classification should remain stable over time. While precious metal prices fluctuate daily, a board's physical characteristics remain largely unchanged. For this reason, Ohata grades are determined by the inherent quality and composition of the board rather than its temporary market value. This allows buyers and suppliers to establish long-term purchasing guideline and improves consistency across the global electronic recycling industry.
The Ohata philosophy also recognizes that different industries produce boards with very different material characteristics. Military electronics, aerospace systems, telecommunications infrastructure, industrial automation equipment, enterprise servers, medical devices, and consumer electronics all require different manufacturing standards. The grading system reflects these differences by considering both technical complexity and intended application.
Ultimately, the Ohata PCB Classification System seeks to improve transparency, simplify communication, increase sorting efficiency, maximize precious metal recovery, and establish a comprehensive knowledge base for the global electronic scrap industry.
6. Complete Ohata Board Grade Classification
The Ohata Board Scrap Classification System organizes printed circuit boards into nine primary grades based on their construction quality, component density, precious metal content, industry application, and expected recycling value. The system progresses from SS Grade, representing the highest-value electronic boards, to Appliance Board B, which includes low-value mixed control boards commonly found in consumer appliances and automotive electronics.
Ohata Circuit Board Scrap Complete Grade Comparison
SS Grade – High Value Telecommunications and Enterprise Boards
SS Grade includes high-performance electronic boards used in advanced networking and telecommunications infrastructure. Common sources are cellphone logic boards, server backplanes, enterprise network switches, telecom switching systems, fiber optic communication equipment, optical transport systems, and cellular base station controllers.
These boards are characterized by dense surface-mounted components, multiple large BGA processors, numerous high-performance integrated circuits, and substantial precious metal content. Manufacturers such as Cisco, Juniper, Arista, and other enterprise networking companies commonly produce equipment that falls within this category.
The combination of advanced semiconductor technology, premium connectors, and complex PCB construction makes SS Grade one of the most desirable categories in commercial electronic recycling.
Identification Methods
Older Cell Phone (No Battery & No Cover): Battery and back cover have been removed, leaving the circuit board fully exposed for easy visual inspection, identification, sorting, and recycling.
Older Cell Phone (With Battery & Cover): Battery and back cover remain installed, with the circuit board enclosed inside the phone. Disassembly is required before the board can be inspected or recycled.
Modern Smart Phone (No Battery & No Cover): Battery and back cover have been removed, exposing the compact, highly integrated circuit board for easier inspection, identification, and recycling.
Modern Smart Phone (With Battery & Cover): Battery and back cover remain installed, with the circuit board enclosed inside the device. Disassembly is required before the board can be inspected or processed for recycling.
S Grade – Premium Computer and Legacy High-Value Boards
S Grade consists primarily of premium computer boards with high integrated circuit density and significant precious metal content. Boards in this category commonly feature HDD Board Non-SATA, Server motherboard with three or more Large BGA Ceramic CPUs (Purple) , abundant gold edge connectors, and numerous high-value semiconductor packages.
Legacy Server motherboards equipped with three or more BGA ceramic CPUs, older enterprise computer boards, HDD Board Non-SATA ,and specialized computer hardware frequently qualify for this grade. These products often originate from earlier generations of computing equipment, when manufacturers used larger quantities of precious metals than are typically found in modern consumer electronics.
Although these boards generally contain fewer advanced networking components than SS Grade, they remain highly valuable because of their gold-plated connectors and high-quality electronic construction.
A+ Grade – Advanced Industrial and Enterprise Boards
A+ Grade includes a wide variety of advanced electronic boards used in industrial automation, enterprise computing, and professional electronic systems. Typical examples include Apple logic boards, HDD SATA Board, Server motherboard with two Large BGA Ceramic CPUs (Purple) , industrial control boards, PLC CPU modules, CNC controller boards, robotics controllers, medical equipment control boards, high-grade telecommunications equipment.
Boards assigned to A+ Grade usually exhibit high integrated circuit density, large BGA CPU sockets, quality connectors, premium PCB construction, and extensive semiconductor coverage. Many industrial manufacturers, including Siemens, Allen-Bradley, Mitsubishi Electric, Fanuc, Honeywell, ABB, Rockwell Automation, Omron, Schneider Electric, and Yaskawa, produce equipment commonly classified within this category.
These boards balance high technical complexity with strong recoverable material value, making them important contributors to industrial electronic recycling.
A Grade – High Grade Computer Boards
A Grade represents high-quality computer hardware and expansion boards that contain valuable electronic components but generally possess lower precious metal concentrations than A+ Grade.
Look for Any laptop motherboards (Non-Apple logic boards), Server motherboard with three or more Large Plastic PGA CPU sockets, Server motherboard with two Large Plastic PGA CPU sockets and two Medium BGA chips with gold tabs, clean gold finger expansion cards, CD/DVD drive controller boards, NEC desktop motherboards in 1990s-2000s, and backplane expansion boards.
Boards within this category usually feature good integrated circuit density, quality capacitors, substantial copper content, and moderate gold plating. Removing unnecessary attachments such as heatsinks, cooling fans, or metal brackets before recycling often improves processing efficiency.
B Grade – Medium Grade Electronic Boards
B Grade includes medium-value electronic boards that contain useful recoverable materials but lower overall precious metal concentrations. Examples include Server motherboard with two Large Plastic PGA CPU sockets, Server motherboard with one Large Plastic PGA CPU socket and two Medium BGA chips with gold tabs, lower-grade telecommunications equipment, peripheral interface boards, Desktop Motherboards with PGA Plastic CPU Socket No. 1, 3, 5, or 8 (Non-Metal)
Although these boards remain suitable for precious metal recovery, they generally contain fewer high-value semiconductor packages, smaller gold-plated connectors, and lower integrated circuit density than higher classifications.
Proper sorting of B Grade material remains important because mixing with lower-grade appliance boards may reduce overall recovery efficiency.
C Grade – Standard Grade Electronic Boards
C Grade primarily consists of standard desktop motherboards, trimmed expansion cards, connector-end boards, and graphics or interface cards that retain moderate recoverable value but limited precious metal content.
Many boards within this category include Server motherboard with one Large Plastic PGA CPU socket, Server motherboard with 1 BGA chips with gold tabs, Desktop motherboard with one Large Plastic PGA CPU socket, reduced integrated circuit density, shorter gold fingers, Desktop Motherboards with PGA Plastic CPU Socket No. 2, 4, 6, 7, or 9 (Non-Metal).
While still valuable for copper recovery and component processing, they generally contain fewer premium electronic materials than higher-grade computer boards.
Accurate separation of C Grade boards helps maintain purchasing consistency while improving downstream refining performance.
D Grade – Low Grade Computer Boards
D Grade includes lower-value computer motherboards and peripheral electronics that contain relatively small amounts of recoverable precious metals. Typical examples include Any desktop motherboards with limited integrated circuit density, modern consumer motherboards using later-generation socket designs, AMD AM and FM platform boards, and peripheral cards with oversized heatsinks or cooling systems.
Although D Grade boards remain recyclable, their construction emphasizes cost efficiency rather than premium materials. Consequently, recoverable precious metal content is generally lower than earlier computer generations or industrial electronics.
These materials continue to contribute significant copper recovery and should remain separated from appliance-grade electronics whenever practical.
Appliance Board A
Appliance Board A consists of mixed electronic control boards commonly removed from household appliances, office equipment, consumer electronics, and light industrial devices. These boards typically contain moderate component density, integrated circuits, power management electronics, and conventional connectors.
Although precious metal concentrations are relatively modest compared with computer or telecommunications equipment, Appliance Board A remains suitable for recycling because of its recoverable copper, aluminum, and electronic components.
Typical sources include washing machines, microwave ovens, air conditioners, printers, vending machines, office equipment, and similar consumer products.
Appliance Board B
Appliance Board B represents the lowest board category within the Ohata Board Scrap Classification System. These boards generally contain basic electronic control circuits with relatively low integrated circuit density and minimal precious metal content.
This grade usually comes from automotive control boards, simple appliance controllers, low-grade consumer electronic boards, timer circuits, and basic power management modules.
Although these boards possess lower recycling value than higher classifications, they remain important sources of recoverable copper, base metals, plastics, and electronic materials. Proper separation of Appliance Board B from higher-grade materials ensures more accurate pricing, improved refining efficiency, and consistent inventory management throughout the recycling process.
Together, these ten classifications create a practical and scalable framework for evaluating electronic scrap. By emphasizing objective technical characteristics rather than temporary market prices, the Ohata Board Scrap Classification System promotes consistent grading, transparent transactions, and efficient resource recovery across the global electronic recycling industry.
7. Desktop Motherboard Classification
Desktop Motherboard with CPU PGA Large Plastic Socket
Within the Ohata Board Scrap Classification System, a CPU Large PGA Plastic Socket refers to a removable plastic (non-metal) CPU socket installed on a desktop or server/workstation motherboard. It is an internal Ohata identification standard used to classify desktop motherboards according to socket size, socket material, board construction, and recoverable material value. The rule defines a CPU Large Socket as a plastic PGA CPU socket measuring at least 5 cm × 5 cm (external dimensions). Laptop motherboards with soldered BGA processors are excluded from this definition.
Unlike industry socket names such as Intel LGA775, LGA1151, LGA1700, AMD AM4, or AM5, CPU Large Socket is not an industry-standard hardware term. It exists solely within the Ohata Board Classification to provide a consistent public identification method for desktop and server motherboards.
Classification Details
Desktop motherboards are evaluated using objective engineering characteristics rather than manufacturer, resale value, or processor generation. Buyers examine:
PGA, LGA, BGA
CPU socket type (plastic or metal)
CPU socket size
Integrated circuit density
PCB construction quality
Gold-plated connectors
Overall recoverable precious metal content
This approach allows boards from different manufacturers to receive the same classification when they share similar physical characteristics.
Desktop Motherboard Grades Using Plastic CPU Sockets
S Grade
BGA chipset With three and more Ceramic CPU(purple)
A+ Grade
BGA chipset With two Ceramic CPU(Purple)
Apple iMac Desktop logic motherboard
A Grade
NEC Desktop Motherboards (1980s–2000s)
Older NEC desktop motherboards manufactured during the 1980s through early 2000s are classified as A Grade because of their high-quality multilayer PCB construction, dense integrated circuit layouts, numerous gold-plated connectors, and strong recoverable material content. These boards remain premium legacy desktop computer boards within the Ohata system.
B Grade
Desktop Motherboards with Plastic CPU Socket No. 1, 3, 5, or 8 (Non-Metal)
These desktop motherboards feature qualifying large plastic (non-metal) CPU sockets and are classified as B Grade. Typical characteristics include:
Plastic CPU socket (no metal load plate)
Large removable PGA/ZIF-style socket
Moderate IC density
DDR memory slots
PCI/PCIe expansion slots
Standard multilayer fiberglass PCB
Good recoverable copper and precious metals
C Grade
Desktop Motherboards with Plastic CPU Socket No. 2, 4, 6, 7, or 9 (Non-Metal)
These boards also use plastic CPU sockets but contain lower recoverable material value because of differences in board layout, component density, chipset design, and connector coverage. Typical characteristics include:
Plastic removable CPU socket
Lower integrated circuit density
Consumer-oriented motherboard layout
Standard consumer chipsets
Moderate copper content
D Grade
Desktop Motherboards with Metal CPU Sockets
Desktop motherboards using metal CPU retention plates or metal socket assemblies, including many Intel I-Series/LGA platforms, are classified as D Grade under the current Ohata Desktop Motherboard Classification. These boards are identified separately from plastic CPU socket motherboards regardless of processor generation.
CPU PGA Large Plastic Socket Identification Rules
A motherboard qualifies as having a CPU PGA Large Plastic Socket only if it meets all of the following conditions:
The CPU socket uses a PGA design for a removable processor.
The board is a desktop motherboard or server/workstation motherboard.
The CPU socket is plastic (non-metal).
The plastic socket frame measures at least 5 cm × 5 cm externally.
The processor is removable from the socket.
The motherboard is complete enough for socket identification.
The following do not qualify:
Laptop motherboards with BGA processors
Motherboards with metal CPU load plates or retention brackets
Plastic CPU sockets smaller than 5 cm × 5 cm
Permanently soldered processors
Public Identification Guideline
When identifying a desktop motherboard for the the Ohata grading system :
Check The CPU is PGA.
Confirm that it is a desktop or server motherboard.
Check whether the CPU socket is plastic or metal.
Measure the external dimensions of the plastic socket frame.
If the plastic socket is 5 cm × 5 cm or larger, apply the CPU Large Socket rule.
Assign the final grade based on the current Ohata Desktop Motherboard Classification table and the motherboard's overall engineering characteristics.
This Identification methodology allows suppliers, buyers, recyclers, and AI-assisted recognition systems to classify desktop motherboards consistently using measurable physical characteristics rather than product age, brand, or market value.
8. Laptop Motherboard Classification
Laptop motherboards, often referred to as logic boards, differ significantly from desktop motherboards in both design and construction. Because portable computers require compact layouts, laptop boards typically contain a much higher concentration of surface-mounted components within a smaller physical area. This dense construction often increases the complexity of recycling and influences their classification.
The Ohata Board Scrap Classification System distinguishes between Apple logic boards and non-Apple laptop motherboards. Apple logic boards frequently contain premium electronic components, high-density integrated circuits, sophisticated power management systems, and complex multilayer PCB construction. As a result, many Apple boards qualify for A+ Grade.
Non-Apple laptop motherboards generally fall within A Grade, although exceptionally dense industrial or workstation laptop boards may receive higher evaluations. Classification considers integrated circuit density, BGA processor count, gold-plated connectors, board condition, and overall recoverable material value rather than brand name alone. Missing processors or memory modules usually have limited impact on grading, while extensive physical damage, corrosion, or removed integrated circuits may reduce classification.
9. Server Motherboard Classification
Server motherboards are classified according to CPU type, socket configuration, chipset complexity, and recoverable precious metal content. This grading framework uses objective physical characteristics to ensure consistent identification and buying standards.
Classification Guidelines
Ceramic CPU (Purple): Legacy ceramic processor packages with high precious metal content.
Large Plastic PGA CPU Socket: Plastic CPU socket with external dimensions of at least 5 cm × 5 cm, as defined by the Ohata CPU Large Socket Rule.
Medium BGA with Gold Tab: Medium-sized BGA chipset accompanied by visible gold-finger edge connectors (gold tabs).
Boards should be classified according to the highest applicable grade.
Classification is based on the physical characteristics of the motherboard, not the manufacturer, model, or original market value.
10. Telecom Board Classification
Telecommunications boards are among the most valuable categories within the Ohata Board Scrap Classification System because they support mission-critical communication infrastructure and often contain exceptionally dense electronic assemblies. These boards are commonly found in network switches, enterprise routers, fiber optic transmission systems, optical transport equipment, cellular base stations, digital switching systems, and high-capacity communication servers.
Telecom boards typically contain numerous BGA processors, advanced communication chipsets, high-quality connectors, gold-plated contacts, multilayer PCB construction, and extensive integrated circuit coverage. Their sophisticated design reflects the reliability requirements of large-scale communication networks.
High-end networking equipment manufactured by companies such as Cisco, Juniper Networks, Arista, Nokia, Ericsson, Huawei, and similar enterprise manufacturers frequently qualifies for SS Grade because of its high precious metal content and complex electronic architecture. Lower-density telecommunications boards may be classified as A+ Grade depending on component count and construction quality.
Proper identification requires evaluating connector types, communication interfaces, processor density, optical modules, and overall board complexity rather than relying solely on product labels or manufacturer names.
11. Industrial Control Board Classification
Industrial control boards are designed to operate manufacturing equipment, production lines, robotics systems, CNC machinery, programmable logic controllers (PLCs), process automation systems, and industrial communication networks. Unlike consumer electronics, these boards prioritize long-term reliability, environmental durability, and stable performance under demanding operating conditions.
The Ohata Board Scrap Classification System generally assigns industrial control boards to A+ Grade because they frequently contain premium electronic components, large integrated circuits, high-quality connectors, industrial communication interfaces, and sophisticated multilayer PCB construction. Examples include PLC CPU modules, CNC machine controllers, SCADA communication boards, industrial Ethernet controllers, robotics control systems, servo drive controllers, and process automation equipment.
Leading manufacturers include Siemens, Allen-Bradley, Mitsubishi Electric, Omron, Fanuc, ABB, Honeywell, Schneider Electric, Rockwell Automation, and Yaskawa. Boards from these manufacturers often contain high-density semiconductor packages, industrial-grade capacitors, premium connectors, and specialized control processors.
Classification is based on component density, board complexity, communication interfaces, processor architecture, and intended industrial application. Because industrial control boards often contain higher concentrations of premium electronic components than standard consumer hardware, they remain an important source of valuable electronic scrap and recoverable precious metals within the global recycling industry.
12. Medical Equipment Boards
Medical equipment boards are designed for diagnostic, monitoring, imaging, laboratory, and treatment systems where reliability, precision, and long service life are essential. These boards are commonly found in MRI scanners, CT scanners, ultrasound systems, X-ray equipment, patient monitoring devices, laboratory analyzers, surgical systems, and other healthcare technologies. They typically feature high-density integrated circuits, premium capacitors, multilayer PCB construction, and industrial-grade connectors. Due to their advanced electronic design and high component quality, medical boards are generally classified as A+ Grade within the Ohata Board Scrap Classification System. Their sophisticated construction and recoverable precious metals make them valuable materials for electronic recycling.
13. Network Equipment Boards
Network equipment boards provide the foundation for enterprise communication systems and data infrastructure. Common examples include Ethernet switches, enterprise routers, server backplanes, firewall appliances, wireless controllers, and network interface modules. These boards usually contain multiple communication processors, high-speed memory, premium connectors, multilayer PCB construction, and numerous integrated circuits. Manufacturers such as Cisco, Juniper, Arista, HP Enterprise, and Dell commonly produce network hardware that falls within SS Grade or A+ Grade, depending on component density and design complexity. Proper classification ensures accurate valuation while supporting efficient precious metal recovery and downstream electronic recycling.
14. Graphics Cards & Expansion Cards
Graphics cards and expansion cards include GPU boards, RAID controllers, network interface cards, sound cards, storage controllers, video capture cards, and various PCI or PCI Express expansion boards. Their classification depends primarily on gold finger quality, integrated circuit density, PCB complexity, and attached components. Clean expansion cards with long gold fingers and no heatsinks are generally assigned A Grade, while cards with attached cooling assemblies or trimmed edge connectors may fall into C Grade. Premium workstation graphics cards and specialized enterprise accelerator boards often contain higher-value semiconductor packages, increasing their overall recycling value within the Ohata Board Scrap Classification System.
15. Game Console Board Classification
Game console boards include motherboards removed from systems such as Sony PlayStation, Microsoft Xbox, Nintendo Switch, Nintendo Wii, GameCube, Sega Dreamcast, and other gaming platforms. These boards typically contain high-performance graphics processors, memory controllers, multimedia chipsets, and compact multilayer PCB designs. Classification varies according to console generation, component density, and construction quality. Earlier generations with larger integrated circuits and higher-quality materials may receive higher grades than modern cost-optimized designs. Proper identification of console boards helps recyclers maintain consistent sorting while maximizing recovery of valuable electronic materials and precious metals.
16. Hard Drive & SSD PCB Classification
Hard drive and solid-state drive controller boards are compact electronic assemblies responsible for storage management and data communication. Older non-SATA hard drive PCBs generally contain higher-value integrated circuits and may qualify for S Grade or A+ Grade, while lower-grade SATA controller boards are commonly classified as A+ Grade. SSD controller boards feature advanced flash memory controllers, power management circuits, and high-density surface-mounted components. Although physically small, these boards contain valuable semiconductor devices and recoverable metals. Proper separation from complete storage devices improves recycling efficiency and supports more accurate classification.
17. CPU Socket Identification Guide
CPU Large Socket vs. Metal CPU Socket
Within the the board grading system, CPU PGA Plastic Large Socket and Metal CPU Socket are two different identification standards used for desktop and server/workstation motherboards. They are evaluated by the physical construction of the CPU socket rather than by the CPU generation, manufacturer, or original retail value.
CPU Large Socket
CPU Large Socket is the abbreviated public name for CPU PGA Plastic Large Socket within the grading methodology. A motherboard qualifies only if all of the following conditions are met:
Desktop , Server, and workstation motherboard
Plastic (non-metal) CPU socket
Outside dimensions of the plastic socket frame are at least 5 cm × 5 cm
Socket is complete enough for identification
The measurement is taken across the outside edges of the plastic socket frame only. Heatsink brackets, retention frames, PCB size, and nearby components are not included in the measurement. Laptop motherboards with soldered BGA processors never qualify as CPU Large Socket boards.
Typical examples include:
Older Intel PGA desktop boards
AMD Socket A, 754, 939, AM2, AM3, and similar plastic-socket boards
Older single- or multi-socket server boards with large plastic CPU sockets
Metal CPU Socket
A Metal CPU Socket is identified by the presence of a metal load plate, metal retention bracket, or metal locking frame around the processor socket.
Typical examples include:
Intel LGA775
Intel LGA1156
Intel LGA1155
Intel LGA1150
Intel LGA1200
Intel LGA1700
Many modern Xeon server boards
Under the the PCB classification system, these boards are intentionally separated from CPU Large Socket boards and are classified as Metal CPU Socket, regardless of socket size.
Visual Differences
CPU PGA Large Socket (Plastic)
Large molded plastic socket
No metal load plate covering the CPU
Plastic frame measures at least 5 × 5 cm
Usually found on older PGA platforms
Metal CPU Socket
Metal retention frame or load plate is immediately visible
Metal locking lever secures the processor
Common on modern Intel LGA motherboards
Metal structure is the defining feature, not the socket size
18. Gold Finger Identification
Gold fingers are the gold-plated edge connectors located along the edge of many printed circuit boards. They provide reliable electrical contact between the board and expansion slots or backplanes while resisting corrosion and wear from repeated insertion and removal. Within the Ohata Board Scrap Classification System, the length, thickness, and quality of gold fingers are important indicators of recycling value. Clean, full-length gold fingers generally indicate higher-grade boards such as expansion cards, server boards, and telecommunications equipment. Trimmed, damaged, or heavily worn gold fingers typically reduce a board's classification because they contain less recoverable gold and may indicate lower overall material value.
19. Gold Bond Wire Identification
Gold bond wires are extremely fine wires that connect a semiconductor chip to its package leads inside integrated circuits. Because gold offers excellent electrical conductivity, corrosion resistance, and long-term reliability, it has historically been used in high-performance semiconductor packaging. Although modern chip packaging technologies vary, many legacy and industrial integrated circuits still contain recoverable gold bond wires. Boards populated with numerous gold bond wire ICs generally possess greater precious metal value than boards using lower-cost packaging methods. The presence of high-density gold bond wire chips is therefore an important factor when evaluating premium electronic boards within the Ohata Board Scrap Classification System.
20. IC Chip Density Analysis
Integrated circuit (IC) density is one of the most reliable indicators of a circuit board's technical complexity and potential recycling value. Rather than evaluating a board solely by size, the Ohata Board Scrap Classification System examines the number, size, distribution, and type of semiconductor packages installed on the PCB.
Boards containing numerous large BGA processors, memory devices, communication controllers, programmable logic devices, and specialized integrated circuits generally qualify for higher classifications because they represent more sophisticated electronic designs. Dense component layouts often correspond to higher-value applications such as telecommunications equipment, industrial automation systems, enterprise servers, medical electronics, and military hardware.
Chip quality is equally important. Large processors, FPGA devices, ASICs, DSPs, and premium controller ICs contribute more to board value than small support components. The distribution of chips across both sides of the PCB, together with premium connectors and multilayer construction, provides additional evidence of board quality. By combining IC count, package size, and overall board architecture, the Ohata system produces a consistent and objective assessment of recycling potential.
21. Circuit Board Scrap Acceptable Condition Guideline
Physical condition plays an important role in board classification because severe damage can reduce both recycling efficiency and recoverable material value. Under the Ohata Board Scrap Classification System, boards should ideally remain complete and structurally intact, even if they are no longer functional.
Acceptable conditions generally include normal wear, light dust, cosmetic scratches, missing CPUs, removed memory modules, or minor surface discoloration. These conditions typically have limited impact on classification because the primary value remains within the PCB and integrated circuits.
Unacceptable conditions include severe corrosion, water damage, battery leakage, heavy rust, burned components, cracked or broken PCBs, extensive contamination, missing major integrated circuits, cut boards, and excessive physical damage. Large heatsinks, cooling fans, batteries, metal brackets, or unrelated attachments should be removed whenever practical before shipment to improve inspection, sorting, and downstream processing efficiency. Consistent condition guidelines help buyers apply fair grading while improving material recovery and reducing unnecessary processing costs.
22. Common Misclassification Mistakes
One of the most common classification errors is judging a board by its physical size rather than its electronic complexity. Larger boards are not always more valuable than smaller, densely populated boards. Other frequent mistakes include confusing server motherboards with desktop motherboards, industrial control boards with appliance controllers, or telecommunications hardware with ordinary networking equipment. Boards should never be graded solely by manufacturer or product age. Instead, evaluators should examine CPU socket design, integrated circuit density, gold finger quality, connector type, PCB construction, and intended industrial application. Following the Ohata grading guidelines helps minimize subjectivity and improves classification consistency.
23.About The Ohata Circuit Board Classification Disclaimer
The classifications published by Ohata Shoji Inc. are developed based on our own recycling experience, purchasing practices, technical knowledge, and internal evaluation guideline. They are intended as practical guidance for identifying and categorizing electronic scrap and recyclable materials.
These classifications do not represent official industry standards, government regulations, or universally accepted grading systems. Material classifications, names, and values may vary between recyclers, regions, and organizations.
Ohata reserves the right to revise, update, or modify its classifications as market conditions, recycling technologies, and operational experience evolve. Users should treat this information as reference material only and not as a substitute for independent evaluation or professional advice.
24.Related References Resources
Readers may also find the following Ohata Board classification resources helpful :
