What Is C Grade Circuit Board Scrap?
C Grade is an internal Ohata classification for qualifying computer motherboards, expansion cards, graphics cards, interface boards, and related populated circuit boards. It is positioned between B Grade and D Grade within the Ohata Board Scrap Classification.

The category includes several physically different board types. A single-socket server motherboard, a legacy desktop motherboard, a trimmed expansion card, and a graphics card with an attached cooling assembly may qualify through different C Grade routes.

C Grade is determined by the complete board’s type, processor or socket configuration, integrated circuits, gold contacts, connectors, attached hardware, completeness, condition, and expected recoverable-material profile.
C Grade does not mean that a board is rejected, technically poor, or without recycling value. It is a purchasing category for boards that retain useful populated PCB material but do not meet the requirements of B Grade or higher classifications.
The Ohata classification evaluates electronic scrap rather than computing performance, original equipment quality, collector value, or resale potential. An expensive gaming card or commercial motherboard can still receive C Grade when evaluated for material recovery.
All boards meeting the current Ohata C Grade standard are purchased under the applicable C Grade category regardless of manufacturer, model popularity, production year, or original price.
Learn more: C Grade vs D Grade — Scrap Identification & Recycling Guide
Which Boards May Qualify as C Grade?
Possible C Grade candidates include:
Server motherboards with one qualifying large plastic PGA CPU socket
Selected server or computer boards with a qualifying soldered BGA processor or chipset and applicable gold-contact features
Selected desktop motherboards with non-metal plastic PGA CPU sockets
Trimmed expansion cards with shortened, cut, damaged, or partly removed gold fingers
Gold-finger cards with attached fans, heatsinks, brackets, or cooling assemblies
Connector-end boards with suitable electronic components and interfaces
Qualifying consumer graphics, multimedia, network, and interface cards
These descriptions identify possible routes rather than guaranteeing C Grade. Board design can vary significantly between manufacturers, models, and hardware revisions.

A graphics card with complete gold fingers and no bulky cooling assembly may belong to another category. A severely stripped card may fall below C Grade or be rejected.
A server motherboard with two qualifying large plastic PGA sockets should be compared with B Grade. A modern desktop motherboard with a metal-framed CPU socket should generally be compared with D Grade.
The product type helps identify the board, but its physical construction and condition determine the applicable Ohata grade.
How to Identify a Possible C Grade Board
Begin by identifying the board’s original function. Determine whether it is a server motherboard, desktop motherboard, graphics card, expansion card, connector board, or another type of computer interface board.
Inspection point
What to examine
Board type
Server, desktop, graphics, expansion, connector-end, multimedia, network, or interface board
CPU socket
Plastic PGA construction, metal load plate, socket size, and processor mounting method
Main components
Removable CPU, soldered BGA package, chipset, GPU, memory, or controller
Gold fingers
Complete, shortened, cut, damaged, worn, or missing
Component density
Distribution of processors, memory devices, controllers, and supporting ICs
Attached hardware
Fans, heatsinks, steel brackets, shields, ducts, and plastic covers
Connectors
Memory, expansion, display, network, storage, audio, and peripheral connections
Completeness
Presence of soldered ICs, sockets, connectors, contacts, and original PCB sections
Condition
Burning, corrosion, fractures, contamination, or component removal
A board should not be assigned C Grade merely because it has a green PCB, one processor position, a certain manufacturer name, or an older production date.

Board markings can help identify the manufacturer, model, hardware revision, processor platform, and original application. These details should be used to locate comparable Ohata examples rather than treated as automatic grading rules.
Reference photographs show examples of qualifying construction. They are not an exclusive list of accepted manufacturers or models.
CPU Socket and Processor Identification
CPU socket construction is particularly important when distinguishing C Grade motherboards from adjacent classifications.
A large plastic PGA CPU socket:
supports a removable PGA processor
has a primarily plastic socket body
does not have a metal load plate
measures at least approximately 5 cm × 5 cm across the plastic body
Measure only the outside edges of the socket itself. Do not include heatsink brackets, retention hardware, surrounding components, or the dimensions of the motherboard.

A nearby metal heatsink bracket does not automatically make the socket a metal CPU socket. A metal CPU socket has a visible load plate, retention frame, or locking assembly forming part of the socket itself.
A qualifying server motherboard with one large plastic PGA socket may fall within C Grade when its socket, chipsets, connectors, component layout, completeness, and condition match current Ohata examples.
The removable CPU may be evaluated separately. Its absence does not automatically disqualify the motherboard when the original socket and soldered components remain intact and identifiable.
Some boards use BGA processors or chipsets soldered directly to the PCB. A BGA package can be recognized as a flat integrated circuit without visible perimeter pins or a removable socket. Its electrical connections are underneath the package.
One large BGA does not prove C Grade. Its function, size, surrounding memory or controller components, gold-contact features, board type, and complete construction must be evaluated together.
Socket type and processor package are identification features, not automatic grades.
Desktop and Server Motherboards
Selected legacy desktop motherboards with non-metal plastic PGA sockets may qualify for C Grade when their complete construction matches current Ohata reference examples.
The socket should remain complete enough to identify. Major soldered chipsets, controllers, memory connectors, expansion slots, storage connections, and original PCB sections should also remain present.
Plastic socket construction alone does not guarantee C Grade. Older desktop boards can differ substantially in size, component density, processor interface, connectors, and recoverable-material profile.
Server motherboards require additional attention because one system may contain processor boards, backplanes, power-distribution boards, storage controllers, and simple interface boards. These components should not automatically receive the same grade simply because they came from one server.
A single qualifying large plastic PGA socket can support C Grade identification. Two qualifying large plastic PGA sockets should prompt comparison with B Grade, while three or more should prompt comparison with A Grade.
Metal-framed desktop and server sockets are not counted as large plastic PGA sockets. Boards with metal load plates require comparison with the applicable metal-socket categories and current Ohata examples.
Motherboard classification depends on the qualifying processor configuration and complete board, not socket count alone.
Expansion Cards, Graphics Cards, and Connector Boards
Gold fingers are the plated edge contacts used to connect an expansion card to a motherboard or another electronic system.
An expansion card may enter C Grade when its gold fingers have been shortened, damaged, partly removed, or cut away with part of the PCB edge. However, sellers should not intentionally trim gold fingers before delivery.
Cutting off the connector edge removes part of the original board and reduces the recoverable material remaining on it. The separated fingers and the damaged card may receive less combined value than the complete item.
Graphics cards and other gold-finger cards may also qualify for C Grade when substantial fans, heatsinks, steel brackets, plastic ducts, or cooling assemblies remain attached. These materials add gross weight and require additional preparation, but they do not have the same recycling profile as the populated PCB.
Possible C Grade card types include:
graphics and video-display cards
sound and multimedia cards
network and communication adapters
storage and peripheral controllers
video-capture and television-tuner cards
selected commercial interface cards
These product names do not guarantee C Grade. A clean card with complete gold fingers and stronger component density may qualify for a different category. A simple, sparsely populated, damaged, or extensively stripped card may receive a lower evaluation.
Connector-end boards provide display, network, audio, storage, power-button, card-reader, or other external connections. Some may qualify for C Grade when they contain suitable controllers and populated circuitry. Simple port boards with little electronic content may fall below C Grade.
The complete contact edge, electronic components, attached materials, and physical condition must be evaluated together.
Why C Grade Boards Have Recycling Value
C Grade boards contain recoverable PCB material together with processors, controllers, memory devices, connectors, plated contacts, and other electronic components.
Copper is commonly present in circuit traces, conductive layers, plated holes, connectors, coils, and power-distribution areas. Gold may be present on edge fingers, socket contacts, memory connectors, selected pins, and other contact surfaces.
Tin, nickel, silver, and other metals may also be present depending on the board’s construction and production period. The amount and location of these materials vary substantially.
A photograph cannot confirm:
PCB layer count or internal copper weight
gold-plating thickness
bonding-wire material inside an IC
the composition of individual capacitors
the quantity of any precious metal
the final recovery yield of the board
Fans, brackets, plastic covers, and large aluminum heatsinks may contain recyclable materials, but they do not have the same recoverable-material profile as a populated circuit board.
A compact controller card can have stronger component coverage than a larger connector board. Conversely, a visually impressive graphics card may receive C Grade when much of its weight comes from cooling hardware.
C Grade value comes from the combined recoverable-material profile of the delivered item, not its size, gaming performance, original price, or one gold-colored feature.
C Grade Boundaries and Common Mistakes
B Grade includes qualifying server motherboards with two large plastic PGA sockets and other computer or interface boards meeting the applicable B Grade requirements.
A Grade includes qualifying non-Apple laptop motherboards, higher plastic-socket server configurations, clean gold-finger expansion cards, optical-drive controller boards, and other applicable premium computer boards.
D Grade includes qualifying modern desktop motherboards with metal-framed CPU sockets and other lower-value computer boards. A modern metal-socket desktop board should not be assigned C Grade solely because it is complete or contains many visible connectors.
Common classification mistakes include:
treating every single-socket motherboard as C Grade
counting a metal CPU socket as a large plastic PGA socket
measuring the heatsink bracket instead of the socket body
assuming every plastic-socket desktop board receives C Grade
grading a motherboard by age, brand, color, or original price
classifying every consumer graphics or interface card as C Grade
assuming a large GPU or heatsink establishes the grade
intentionally cutting gold fingers before delivery
overlooking removed soldered ICs, connectors, or PCB sections
mixing populated computer boards with appliance boards or bare PCBs
C Grade is not a general category for everything below B Grade. The board must still match an applicable C Grade route and retain sufficient populated PCB material.
Buying, Downgrade, and Rejection Guidance
C Grade boards should be delivered substantially complete, identifiable, dry, and reasonably clean. Soldered processors, GPUs, BGA packages, chipsets, controller ICs, sockets, connectors, remaining gold contacts, and original PCB sections should remain attached.

Removable CPUs and RAM modules may be separated for individual evaluation. Fans, heatsinks, steel brackets, shields, plastic covers, and loose cables may also be removed when this can be done without damaging the PCB or its components.
Removal of cooling hardware is not always required. If disassembly could crack the board, damage the GPU, tear off memory packages, or break the gold-finger edge, leave the assembly intact for inspection.
A board may be downgraded when:
major soldered ICs or controllers have been removed
gold fingers or connector areas have been cut
important sockets or connectors are missing
substantial PCB sections have broken away
attached material prevents accurate evaluation
the board is heavily corroded, burned, or contaminated
Minor dust, ordinary wear, faded markings, light scratches, or limited surface discoloration do not automatically prevent C Grade classification when the board remains recognizable and retains its qualifying components.
Empty or nearly empty PCBs should not be presented as complete C Grade boards. Severely burned, chemically treated, hazardous, deliberately misrepresented, heavily contaminated, or extensively fragmented material may be rejected.
Different grades and board types should be separated whenever practical. Mixed loads require additional inspection and sorting and may receive a lower combined evaluation.
Do not burn boards, scrape plated contacts, intentionally cut off gold fingers, remove soldered chips with uncontrolled heat, or apply chemicals to test for precious metals. These actions can reduce recoverable value and create health, fire, and environmental hazards.
Final classification is determined by the board’s type, socket or processor configuration, component density, gold-contact condition, attached materials, completeness, condition, recoverable-material profile, and current buying requirements.