ohata.ai
Your scrap knowledge hub
Reference library

Scrap Wiki

Search Ohata reference pages, buying notes, and recycling guidance by topic.

6 pages Author: Nicole Hana Sekino | Ohata.Ai

Latest pages

Last Updated: September 15, 2026

What Is a BGA Chip? A Complete Guide to Ball Grid Array Packaging

A BGA chip is an integrated circuit package that uses a grid of solder balls underneath to connect directly to a circuit board. BGA packaging allows many electrical connections to fit within a compact area and is commonly used for processors, graphics chips, memory, chipsets, and controllers. Learn how BGA differs from PGA, LGA, and leaded IC packages and where each design may be preferred.

Last Updated: September 15, 2026

Gold Fingers and Gold-Plated Contact Identification Guide

Gold fingers are narrow, gold-plated contacts found along the edges of memory modules, graphics cards, and other circuit boards. This guide explains how to identify them and how hard gold differs from other gold-colored PCB finishes. Learn what alignment notches, beveled edges, shorter contacts, and insertion marks can reveal about their design and condition.

Last Updated: September 8, 2026

Ohata Shoji America Inc. Releases Ohata.AI Vision 1.0 Beta

Ohata.AI Vision 1.0 Beta 1.0 is an AI-assisted identification and preliminary classification service for electronic equipment and e-scrap. Users can upload photographs of a circuit board, motherboard, mobile phone, or other currently supported item. Ohata.AI Vision then reviews the visible evidence and produces a structured report that may include the likely item type, observed components and condition, a preliminary Ohata classification, and an eligible current reference price for the United States or Canada.

Visit Our Yards
AI Scrap Grading Ohata.AI Vision 1.0 Beta 1.0 Upload board photos for grade and reference price