What is Ohata CPU B Grade?

Ohata CPU B Grade is a recycling category for Ball Grid Array (BGA) processors and related processing chips. It commonly includes laptop CPUs, GPUs, graphics processors, motherboard chipsets, and other qualifying BGA IC chips.

How can I identify a CPU B Grade chip?

Check the underside of the component. A B Grade chip normally has a grid of solder balls or clearly visible BGA contact positions. The top may show a manufacturer name, model number, production code, or protective surface.

Are all laptop CPUs classified as CPU B Grade?

No. Only laptop processors using qualifying BGA construction are classified as CPU B Grade. Removable PGA or LGA laptop processors must be classified according to their actual package and contact design.

Are BGA GPUs and motherboard chipsets accepted as CPU B Grade?

Yes. Qualifying BGA GPUs, graphics chips, motherboard chipsets, and comparable processing ICs may be included in CPU B Grade when they meet the Ohata identification and condition standards.

What is the difference between CPU A Grade and CPU B Grade?

CPU A Grade mainly includes modern removable LGA processors with flat gold contact pads. CPU B Grade components use solder balls underneath and are normally soldered directly onto a motherboard or graphics board.

How does CPU B Grade differ from CPU S Grade?

CPU S Grade processors use a Pin Grid Array package with projecting gold-plated pins. CPU B Grade chips do not have projecting pins; they use a Ball Grid Array connection system.

What recoverable materials are found in CPU B Grade chips?

Depending on their age and construction, BGA chips may contain copper, tin-based solder, nickel, silver, gold, or palladium. Some packages use gold bonding wires, while newer chips may use copper-based internal connections.

What is Ohata Shoji America Inc.?

We are a premier Green-Tech E-Commerce platform specializing in sustainable electronic scrap procurement.

Who can use the Ohata.ai online platform?

Our digital ecosystem serves both individual consumers recycling small tech loads and large corporate enterprises liquidating mass data centre infrastructure.

Do you purchase high-performance AI hardware?

Yes, we specialize in the online procurement and data-secure decommissioning of complex AI servers, GPUs, and high-capacity storage.

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CPU B Grade ( BGA CPU and IC chips) buying

CPU B Grade ( BGA CPU and IC chips) buying scrap price

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Key Buying Introduction

We buy CPU B Grade ( BGA CPU and IC chips) from a minimum of 1 lb.
Ohata CPU B Grade includes BGA-packaged laptop CPUs, GPUs, chipsets, and related processing ICs. These components are identified by their solder-ball connection arrays and are purchased according to the unified CPU B Grade price.
CPU B Grade mainly covers processors and integrated chips using Ball Grid Array construction. Recycling value comes from recoverable copper, solder, nickel, and small quantities of precious metals contained inside the package.
Qualifying BGA CPUs, graphics processors, and motherboard chipsets are classified by package construction rather than individual model. Clean and properly separated components that meet the standard receive the Ohata CPU B Grade price.
The key feature of CPU B Grade is the solder-ball grid underneath the chip. It differs from gold-pin PGA CPUs, flat-contact LGA CPUs, ceramic processors, and low-value plastic IC scrap.

Updated: Aug 06,2026

Today's scrap price for this material

50.00 USD / lb

The Price is buying by Yard of Seattle, WA, United States.

Price history

Price history will appear here as updates are recorded.

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Key Buying Introduction

We buy CPU B Grade ( BGA CPU and IC chips) from a minimum of 1 lb.
Ohata CPU B Grade includes BGA-packaged laptop CPUs, GPUs, chipsets, and related processing ICs. These components are identified by their solder-ball connection arrays and are purchased according to the unified CPU B Grade price.
CPU B Grade mainly covers processors and integrated chips using Ball Grid Array construction. Recycling value comes from recoverable copper, solder, nickel, and small quantities of precious metals contained inside the package.
Qualifying BGA CPUs, graphics processors, and motherboard chipsets are classified by package construction rather than individual model. Clean and properly separated components that meet the standard receive the Ohata CPU B Grade price.
The key feature of CPU B Grade is the solder-ball grid underneath the chip. It differs from gold-pin PGA CPUs, flat-contact LGA CPUs, ceramic processors, and low-value plastic IC scrap.

Buying Details of Conditions

Introduction, Construction, Components, and Recycling Value

Ohata CPU B Grade is a recycling category primarily covering Ball Grid Array (BGA) processors and related IC chips. Typical examples include laptop CPUs, laptop or desktop GPUs, motherboard chipsets, graphics processors, and other processing chips that use solder-ball connections underneath the package.

Unlike PGA processors with projecting pins or LGA processors with flat contact pads, BGA chips are designed to be soldered directly onto a circuit board. Their underside contains a grid of small solder balls instead of removable pins. The package commonly consists of a silicon die, organic or ceramic substrate, internal conductive connections, encapsulation material, and a BGA solder-ball array.

Ohata CPU B Grade Classification, Identification Guide

A component may qualify as Ohata CPU B Grade when it has the following characteristics:

It uses a Ball Grid Array package.
It is a laptop CPU, GPU, graphics chip, motherboard chipset, or comparable processing IC.
The underside originally contains an organized grid of solder balls or corresponding BGA contact positions.
It is separated from circuit boards and reasonably identifiable as a BGA processor or processing chip.

Inspectors should check both sides of the component. The upper side normally carries manufacturer markings, codes, or a protective die cover, while the underside displays the distinctive solder-ball grid. Components that merely resemble processors but are not CPUs, GPUs, chipsets, or qualifying IC chips may be classified differently.

Recoverable Materials, Buying Standards, and Handling

Recoverable materials may include copper from internal conductors and substrates, tin-based solder from the BGA balls, nickel in barrier plating, and small quantities of gold, silver, or palladium depending on the chip’s construction and manufacturing generation. Some BGA packages use gold bonding wires, while newer devices may use copper-based connections.

Intel Core i5 8250U CPU B GRADE Burned By Fire

CPU B Grade material should be kept clean, dry, and separated from complete circuit boards, heatsinks, brackets, batteries, and unrelated electronic components. Avoid burning, chemical stripping, crushing, or excessive heating. Heavy contamination, corrosion, broken packages, attached heatsinks, or mixed unidentified material can cause downgrading to CPU F Grade.

Intel Core i7 9750H CPU B GRADE Dirt or Mud

Comparison, and Official Ohata Classification

CPU B Grade can be distinguished from other grades by its solder-ball connection system:

CPU SSS: ceramic CPU with a gold cap and gold-plated pins.
CPU SS: high-grade ceramic CPU without a gold cap.
CPU S: PGA CPU with projecting gold-plated pins.
CPU A: modern LGA CPU with flat gold contact pads.
CPU B: BGA CPU, GPU, chipset, or IC with solder balls underneath.
CPU C: lightweight fiber or organic-substrate CPU.
CPU D: cartridge-style Slot CPU or processor module.
CPU E: small, low-value plastic processors or ordinary IC chips.
CPU F: damaged, dirty, contaminated, mixed, or unidentified CPU scrap.

CPU B GRADE Different Grades and Models mixed

Under the official Ohata Board Scrap Classification System, qualifying BGA processors, GPUs, chipsets, and related processing ICs are classified as Ohata CPU B Grade and purchased according to the applicable CPU B Grade price.

View more Ohata's CPU recycling classifications

CPU SS Grade ( High Grade Ceramic CPU)

CPU S Grade ( Gold Pin BGA CPU)

CPU A Grade ( Modern LGA CPU)

CPU B Grade ( BGA CPU and IC chips)

CPU C Grade ( Fiber CPU)

CPU D Grade ( Slot CPU/ CPU Module)

CPU E Grade ( Plastic IC and Processor Chips)

CPU F Grade ( Damaged,Dirty and Mix CPU)

FAQ

1. What is today’s price for CPU B Grade ( BGA CPU and IC chips) buying?: As of Aug 06,2026, Ohata Shoji America Inc., (Seattle, WA, United States) is purchasing CPU B Grade ( BGA CPU and IC chips) buying at 50.00 (USD/lb). We provide competitive scrap prices in Seattle, Bellevue, Renton, Tukwila, Kent, SeaTac, Tacoma, Everett, and surrounding communities.
2. What is Ohata CPU B Grade?: Ohata CPU B Grade is a recycling category for Ball Grid Array (BGA) processors and related processing chips. It commonly includes laptop CPUs, GPUs, graphics processors, motherboard chipsets, and other qualifying BGA IC chips.
3. How can I identify a CPU B Grade chip?: Check the underside of the component. A B Grade chip normally has a grid of solder balls or clearly visible BGA contact positions. The top may show a manufacturer name, model number, production code, or protective surface.
4. Are all laptop CPUs classified as CPU B Grade?: No. Only laptop processors using qualifying BGA construction are classified as CPU B Grade. Removable PGA or LGA laptop processors must be classified according to their actual package and contact design.
5. Are BGA GPUs and motherboard chipsets accepted as CPU B Grade?: Yes. Qualifying BGA GPUs, graphics chips, motherboard chipsets, and comparable processing ICs may be included in CPU B Grade when they meet the Ohata identification and condition standards.
6. What is the difference between CPU A Grade and CPU B Grade?: CPU A Grade mainly includes modern removable LGA processors with flat gold contact pads. CPU B Grade components use solder balls underneath and are normally soldered directly onto a motherboard or graphics board.
7. How does CPU B Grade differ from CPU S Grade?: CPU S Grade processors use a Pin Grid Array package with projecting gold-plated pins. CPU B Grade chips do not have projecting pins; they use a Ball Grid Array connection system.
8. What recoverable materials are found in CPU B Grade chips?: Depending on their age and construction, BGA chips may contain copper, tin-based solder, nickel, silver, gold, or palladium. Some packages use gold bonding wires, while newer chips may use copper-based internal connections.
9. What is Ohata Shoji America Inc.?: We are a premier Green-Tech E-Commerce platform specializing in sustainable electronic scrap procurement.
10. Who can use the Ohata.ai online platform?: Our digital ecosystem serves both individual consumers recycling small tech loads and large corporate enterprises liquidating mass data centre infrastructure.
11. Do you purchase high-performance AI hardware?: Yes, we specialize in the online procurement and data-secure decommissioning of complex AI servers, GPUs, and high-capacity storage.