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HP Pegatron IPISB-CU (Carmel2) Identification & D-Grade Guide

Last Updated: July 28, 2026
Quick Facts
  • Wiki page updated By Ohata Wiki Editor Team : July 28, 2026.

  • Identified board model: HP / Pegatron IPISB-CU (Carmel2) desktop motherboard, board assembly family 644016-001 / 656846-001 / 656846-002 depending on revision and OEM service listing. The board carries the visible IPISB-CU model marking and an HP-style assembly label showing AS# 644016-001. Replacement and specification references identify IPISB-CU as the HP/Compaq “Carmel2” motherboard manufactured by Pegatron, with Intel H61 chipset, LGA1155 socket, DDR3 memory, PCI Express expansion, Realtek audio, and Realtek Gigabit Ethernet.

  • Desktop or laptop board: This is a desktop computer motherboard, not a laptop motherboard. It uses a desktop Intel LGA1155 metal load-plate CPU socket, two full-size 240-pin DDR3 DIMM sockets, a full-length PCI Express x16 graphics slot, PCI Express x1 slots, ATX-style power connectors, rear desktop I/O, SATA connectors, and a Micro-ATX layout.

  • Common computer brand and use: This motherboard is normally found in HP Pavilion, HP Compaq, and related HP consumer desktop systems from the Sandy Bridge generation. It is an OEM desktop board, but computer hobbyists can still use it for personal repair or custom bench builds if they understand the HP BIOS limitations, front-panel pinout, power supply, cooling, graphics-card compatibility, and case-fit requirements. Retail and service references identify it as an HP / Pegatron IPISB-CU Carmel2 motherboard, with HP part numbers such as 644016-001 and 656846-001/002.

  • CPU interface: Intel LGA1155 / Socket H2. IPISB-CU specifications list the socket type as LGA 1155, with support for Intel Core i7-2600S, Core i5-2xxx, and Core i3-2xxx processor upgrades in the referenced HP specification copy.

  • CPU package size: 37.5 mm × 37.5 mm. Intel’s LGA1155 processor specification for the Core i5-2500 lists socket support as LGA1155 and package size as 37.5 mm × 37.5 mm.

  • Chipset: Intel H61. IPISB-CU / Carmel2 specifications identify the chipset as Intel H61.

  • Memory: Two 240-pin DDR3 DIMM sockets, single-channel memory architecture in the referenced HP specification copy, PC3-8500 1066 MHz and PC3-10600 1333 MHz support, non-ECC unbuffered memory, and up to 8 GB on 64-bit systems in that reference.

  • Expansion: One PCI Express x16 slot, three PCI Express x1 slots, and one PCI Express Mini Card x1 slot are listed in the IPISB-CU specifications.

  • Graphics status: The board has motherboard display output through VGA and DVI-D. The referenced specification describes Intel Graphics Media Accelerator HD integrated graphics and states that integrated video is not available if a graphics card is installed. This graphics function is platform/processor-based and should not be confused with a separate removable graphics card.

  • Audio and LAN: The IPISB-CU specification lists Realtek ALC656 / ALC656GR 6-channel high-definition audio and RTL8171EH-CG Gigabit Ethernet, with data transfer speeds up to 10/100/1000 Mb/s.

  • Official Ohata recycling classification: Ohata D Grade Board Scrap, assuming a compatible LGA1155 CPU is installed and the board remains complete, clean, dry, and structurally intact. The Ohata Board Grade Class places i-series motherboards with metal CPU socket cover and lever designs, desktop motherboards with metal sockets, integrated motherboards, and lower-value modern computer boards in D Grade. The detailed D Grade standard also describes later-generation Intel desktop motherboards and modern consumer computer boards as D Grade because they use cost-efficient construction and contain lower recoverable precious-metal concentration than higher grades.

  • Important standard note: The Ohata Board Scrap Classification System is an internal Ohata value-identification and sorting method for electronic scrap purchasing, warehouse grading, and recycling education. It is not an international standard, government regulation, ISO standard, or universally accepted industry classification.

Related Scrap Prices

Board D Grade (Lower computer Board) buying and related Scrap Prices as of 1:00 AM on August 6, 2026

Introduction, Construction, Components, and Recycling Value

Introduction

Start with the white HP assembly label and the “IPISB-CU” silkscreen. A 644016-001 or 656846-series identifier, LGA1155 socket, two DDR3 slots and the HP-specific header layout support a Carmel2 identification; use the system product number to confirm chassis compatibility.

This is a desktop motherboard, not a laptop motherboard. The identification is supported by its desktop LGA1155 CPU socket with metal load plate and lever, two full-size 240-pin DDR3 DIMM sockets, PCI Express expansion slots, 24-pin ATX main power connector, 4-pin CPU power connector, rear desktop I/O, SATA storage connectors, and Micro-ATX board outline. A laptop motherboard would normally use SO-DIMM memory, flat-flex display connectors, battery connectors, proprietary notebook power circuits, and an irregular notebook chassis shape. The IPISB-CU uses a standard desktop PC layout and should be sorted with desktop motherboard scrap.

HP Pegatron IPISB CU (Carmel2) Motherboard Introduction
HP Pegatron IPISB CU (Carmel2) Motherboard Introduction

The board is identified by the printed IPISB-CU model text, the Carmel2 HP/Compaq platform name, and an HP assembly label in the 644016-001 part family. The referenced service specification describes IPISB-CU as an HP / Pegatron motherboard with Intel H61 chipset, LGA1155 socket, two 240-pin DDR3 DIMM sockets, PCI Express expansion, integrated Intel graphics output, Realtek audio, Realtek Gigabit Ethernet, and Micro-ATX dimensions.

From a recycling perspective, the IPISB-CU contains recoverable material value but does not belong to a premium board class. Its value comes from the assumed installed LGA1155 CPU, LGA1155 socket contacts, DDR3 connector contacts, PCI Express connector contacts, chipset package, audio and LAN controllers, BIOS flash, voltage-regulation components, copper-bearing PCB layers, solder, nickel-plated connector metals, MLCCs, and limited gold-bearing contact surfaces. Under Ohata’s internal value-sorting method, this combination places the board in D Grade Board Scrap when complete and CPU-installed.

Common Computer Brand and Practical Use

The IPISB-CU (Carmel2) is mainly an HP / HP Compaq OEM desktop motherboard. It appears in HP Pavilion p6 / p7 and Compaq consumer desktop families depending on regional model, part number, and system configuration. Service and parts listings identify it as HP IPISB-CU / Carmel2 with HP part families such as 644016-001, 656846-001, and 656846-002.

Because it is an OEM board, it was not originally designed like a universal retail enthusiast motherboard. It may require HP-specific BIOS support, HP front-panel wiring, HP case wiring, compatible power supply connectors, and supported CPU lists. However, computer hobbyists may still use it for personal repair, test benches, low-cost desktop rebuilds, or custom projects. Practical hobbyist assembly requires checking front-panel pin assignments, BIOS CPU support, memory compatibility, power-supply compatibility, cooler clearance, case mounting, and GPU firmware compatibility. A discrete graphics card can be installed in the PCI Express x16 slot, but the board’s BIOS generation and power-supply environment should be considered before upgrades.

For recycling, hobbyist usability does not control the grade. The board is graded by its physical construction, CPU socket type, component density, CPU presence, connector completeness, contamination condition, and recoverable material profile. The original HP brand and part number are useful for identification, but the Ohata grade is based on value-sorting characteristics rather than brand alone.

CPU Socket and CPU Package Size

The CPU interface is Intel LGA1155, also known as Socket H2. The IPISB-CU specification lists the socket type as LGA 1155 and lists Core i7-2600S 65 W, Core i5-2xxx 65 W, and Core i3-2xxx 65 W upgrade categories.

LGA1155 is a land-grid-array socket. The motherboard socket contains the delicate spring contacts, while the CPU package has flat conductive lands on its underside. The socket uses a metal load plate and lever. This socket style is important for visual grading because Ohata’s Board Grade Class specifically places i-series motherboards where the CPU socket has a metal cover and lever into D Grade.

The CPU package size is 37.5 mm × 37.5 mm. Intel’s Core i5-2500 specification identifies LGA1155 as the supported socket and lists the package size as 37.5 mm x 37.5 mm. This measurement should be recorded in the recycling guide because it confirms that the board belongs to the LGA1155 desktop CPU family rather than an AMD AM-series PGA platform, Intel LGA775, Intel LGA1156, Intel LGA1366, or a mobile notebook socket.

The CPU is a major value component. A CPU-installed IPISB-CU motherboard is worth more than the same board without a CPU because the processor contributes semiconductor die material, package substrate, contact lands, internal metal layers, heat-spreader metal, and precious-metal-bearing internal features. If the CPU is missing, the board remains recyclable, but the value is lower. If the LGA1155 socket is bent, cracked, burned, corroded, contaminated, or removed, the downgrade is more severe because both the CPU and the socket contact field are compromised.

Intel H61 Chipset and Integrated Platform Design

The IPISB-CU (Carmel2) uses the Intel H61 chipset. Both the detailed IPISB-CU specification copy and HP / Pegatron parts reference identify the chipset as Intel H61.

The H61 generation is an integrated desktop chipset platform for Intel Sandy Bridge LGA1155 processors. Many functions that previously required separate chips are integrated into the CPU and chipset. The CPU contains important functions such as the processor cores, memory controller, and integrated graphics engine on supported processors, while the chipset handles platform I/O. This integration reduces component count and lowers the amount of recoverable precious metal compared with older, more discrete desktop motherboard architectures. That construction pattern is one of the reasons the board fits Ohata D Grade rather than higher computer-board categories.

The chipset package should remain attached. If the chipset is removed, cracked, burned, scraped, or heavily corroded, the motherboard loses a major semiconductor component and should be downgraded.

Graphics Output and Expansion

The board includes motherboard display output through VGA and DVI-D according to the specification. The referenced IPISB-CU specification describes Intel Graphics Media Accelerator HD integrated graphics and states that integrated video is unavailable if a graphics card is installed. It also lists PCI Express x16 graphics-card support.

This graphics function should not be confused with a discrete graphics card. The motherboard has display ports, but the graphics engine is associated with the Intel CPU/platform. If a separate PCI Express graphics card is installed, that card should be removed and sorted separately as graphics-card scrap. The IPISB-CU remains a desktop motherboard and should not be graded as a GPU card.

The expansion layout includes one PCI Express x16 slot, three PCI Express x1 slots, and one PCI Express Mini Card x1 slot in the IPISB-CU specification. These slots contain recoverable connector contacts, solder joints, and copper routing. They are useful value-bearing features, but they do not give the board the long external gold-finger edge connector of a removable expansion card.

Memory Subsystem

The IPISB-CU uses two 240-pin DDR3 DIMM sockets. The specification lists single-channel memory architecture, DDR3 DIMM support, PC3-8500 1066 MHz and PC3-10600 1333 MHz support, non-ECC unbuffered memory, 1 GB / 2 GB / 4 GB DIMM support, and up to 8 GB on 64-bit systems in the cited HP specification copy.

These are desktop memory slots, not laptop SO-DIMM slots. Each DIMM connector contains plated contacts, spring structures, soldered legs, and copper alloy material. If memory modules are present, they are normally sorted separately as RAM scrap. The motherboard itself should retain its DIMM sockets. Removed, cracked, burned, or heavily corroded memory slots reduce connector completeness and can lower buying value.

Audio, LAN, Storage, and Internal Connectors

The audio section is listed as Realtek ALC656 / ALC656GR high-definition 6-channel audio with jack sensing. The LAN section is listed as RTL8171EH-CG Gigabit Ethernet with speeds up to 10/100/1000 Mb/s and 1000-Base-T transmission support.

The internal connector list includes one ATX power connector, one ATX CPU power connector, CPU fan connector, system fan connector, four SATA 2.0 connectors, internal S/PDIF output, front-panel audio, ROM recovery connector, hood-sense connector, one-touch reset, one-touch recovery, front-panel connector, and USB internal connector positions.

These connectors matter for recycling because they contain copper, solder, plated contacts, tin, nickel, and plastic housings. They also help inspectors distinguish the board from appliance control boards, power-supply boards, and laptop motherboards. A complete IPISB-CU board should retain these connectors unless only non-electronic accessories such as heatsinks, fans, cables, or brackets have been removed.

PCB Construction and Recycling Value

The IPISB-CU is a Micro-ATX board measuring 24.4 cm × 24.4 cm, or 9.6 in × 9.6 in, according to the specification. It is a multilayer fiberglass desktop PCB with internal copper planes, signal traces, ground planes, voltage-regulation sections, soldered rear I/O ports, SATA connectors, USB headers, memory slots, PCI Express slots, chipset packages, and small controller ICs.

The board has value, but its value profile is moderate to low compared with higher electronic scrap grades. It has lower IC density than laptop boards, Apple logic boards, telecom boards, industrial controllers, and server boards. Its modern Intel H61 platform consolidates many functions into the CPU and chipset, reducing the number of separate support chips and reducing recoverable precious-metal concentration. The board remains useful for copper and limited precious-metal recovery, but Ohata’s internal grading system places this type of i-series metal-socket desktop motherboard in D Grade.

Ohata D Grade Classification, Identification Guide, and Apple Logic Board Types

Official Ohata D Grade Classification

The HP / Pegatron IPISB-CU (Carmel2) motherboard is classified as:

Ohata Board Scrap Classification: D Grade Board Scrap

This classification assumes a compatible Intel LGA1155 CPU is installed and that the board is complete, clean, dry, and structurally intact.

The Ohata Board Grade Class lists D Grade as a low-grade computer-board category and specifically includes i-series motherboards with metal CPU socket cover and lever designs, desktop motherboards with metal sockets, integrated motherboards, peripheral lower-grade boards, and certain consumer family-game boards. The detailed D Grade standard further explains that D Grade includes later-generation Intel desktop motherboards, integrated desktop motherboards, and cost-efficient consumer hardware with lower precious-metal concentration than higher grades.

HP Pegatron IPISB CU (Carmel2) Motherboard D Grade Board Scrap
HP Pegatron IPISB CU (Carmel2) Motherboard D Grade Board Scrap

The IPISB-CU matches that rule because it has:

  • Intel LGA1155 metal socket with load plate and lever.

  • Intel H61 consumer desktop chipset.

  • Two DDR3 DIMM slots.

  • Processor-based integrated graphics output.

  • Standard Realtek audio and LAN.

  • PCI Express expansion.

  • Micro-ATX OEM desktop construction.

  • Cost-efficient modern consumer motherboard layout.

  • Lower semiconductor density than laptop, server, telecom, industrial, or Apple logic boards.

Why This Board Is Not C Grade

C Grade includes standard desktop motherboards, trimmed expansion cards, connector-end boards, graphics cards, interface cards, and standard consumer boards with moderate recoverable value. The IPISB-CU has some standard motherboard features, including CPU socket, memory slots, PCI Express slots, SATA connectors, LAN, audio, and rear I/O. However, Ohata’s more specific D Grade rule applies because this board is a later Intel i-series desktop motherboard with a metal LGA socket and cost-optimized integrated platform architecture.

The board also has only two memory slots, a simplified H61 chipset layout, ordinary Realtek controller sections, and modest IC population. Those features support D Grade rather than C Grade.

Why This Board Is Not B Grade

B Grade includes medium-grade boards such as medium-value desktop motherboards, lower-grade telecom boards, peripheral interface boards, embedded boards, and entry-level server-type boards with moderate integrated circuit density and stronger connector or controller value. The IPISB-CU is not a server motherboard, telecom board, workstation board, embedded industrial controller, or commercial interface board. It is a standard HP / Pegatron consumer desktop motherboard designed for cost-efficient household and office PCs.

Even when a CPU is installed, the CPU improves value within D Grade; it does not change the board into B Grade. The complete board architecture remains a modern Intel i-series OEM desktop design.

Why This Board Is Not A Grade or A+ Grade

A Grade includes non-Apple laptop motherboards, large single-socket server boards, clean gold-finger expansion cards, CD/DVD controller boards, enterprise backplanes, and selected high-grade computer boards. The IPISB-CU is not a laptop motherboard, not a server board, not a clean gold-finger expansion card, and not a backplane.

A+ Grade includes Apple logic boards, PLC CPU modules, CNC controllers, robotics boards, medical control boards, industrial communication boards, large multi-socket server boards, and other advanced industrial or enterprise boards. The IPISB-CU does not have the high-density Apple, industrial, medical, telecom, or enterprise construction required for A+ Grade.

Why This Board Is Not S, SS, or SSS Grade

S Grade is associated with premium legacy computer boards, boards with multiple ceramic CPUs, non-SATA hard drive controller boards, and high-value older enterprise computer hardware. The IPISB-CU uses a modern organic LGA1155 processor package and has no ceramic CPU array.

SS Grade is used for enterprise networking, telecom switching, fiber optic communication boards, server backplanes, smartphone logic boards, and carrier-class communication systems. The IPISB-CU has ordinary desktop Gigabit Ethernet, not carrier-grade network hardware.

SSS Grade is reserved for military, aerospace, satellite, radar, defense, scientific, and mission-critical boards with ultra-high-reliability construction, ceramic packages, gold-pin connectors, and very high precious-metal concentration. The IPISB-CU is a mass-produced consumer desktop motherboard and does not meet SSS criteria.

Identification Guide

Step 1 – Confirm Desktop Construction

Check for a desktop Intel LGA1155 socket, full-size DDR3 DIMM sockets, rear desktop I/O, PCI Express slots, SATA connectors, ATX power connector, and a square Micro-ATX shape. These characteristics confirm a desktop motherboard rather than a notebook motherboard.

Step 2 – Confirm the IPISB-CU Marking

Look for IPISB-CU printed on the PCB. The board may also carry an HP assembly sticker in the 644016-001 family. Parts references identify IPISB-CU as an HP / Pegatron Carmel2 motherboard.

Step 3 – Confirm LGA1155

The CPU socket should be Intel LGA1155 with a metal load plate and lever. The matching processor package size is 37.5 mm × 37.5 mm.

Step 4 – Confirm Intel H61

The chipset should correspond to the Intel H61 platform. IPISB-CU specifications identify the chipset as Intel H61.

Step 5 – Confirm Memory and Expansion

The board should have two 240-pin DDR3 DIMM slots, one PCI Express x16 slot, three PCI Express x1 slots, and one PCI Express Mini Card x1 slot.

Step 6 – Confirm Rear I/O and Internal Connectors

Expected rear I/O includes USB, LAN, DVI-D, VGA, and analog audio jacks. Internal connectors include ATX power, CPU power, fan connectors, SATA, S/PDIF, front-panel audio, recovery connectors, and USB headers.

Apple Logic Board Types Comparison

Apple logic boards are not part of this board’s identity. Apple MacBook logic boards are compact high-density laptop boards with proprietary shapes, dense BGA packages, fine-pitch connectors, advanced power management, and much higher component density per unit area. Ohata’s Apple logic-board guide treats genuine Apple laptop logic boards as A+ Grade material because of dense semiconductor coverage, premium multilayer construction, and high-value connector systems.

The IPISB-CU is a desktop HP / Pegatron motherboard with a removable LGA1155 CPU, two full-size DDR3 DIMM slots, PCI Express slots, ATX power input, and Micro-ATX layout. It should not be mixed with Apple logic board scrap.

Recoverable Materials, Buying Standards, and Handling

Recoverable Materials

The IPISB-CU contains the material profile of D Grade desktop motherboard scrap. D Grade computer boards have lower precious-metal concentration than C, B, A, A+, S, SS, or SSS Grade materials, but they remain recyclable because they contain copper, CPU socket contacts, memory contacts, expansion-slot contacts, integrated circuits, solder, nickel-plated connectors, MLCCs, and limited gold-bearing material.

Copper is the largest recoverable metal by weight. It is present in internal PCB layers, power planes, ground planes, signal traces, voltage-regulation paths, inductors, chokes, memory routing, PCI Express routing, SATA routing, USB routing, Ethernet magnetics, ATX connector routes, and connector pins.

Gold is present in limited but important areas. Gold-bearing locations may include the installed CPU package, LGA1155 socket contacts, DDR3 memory-slot contacts, PCI Express slot contacts, USB connector contacts, LAN contacts, test pads, and gold bond wires inside integrated circuits.

Silver may be present in selected contacts, solder materials, and semiconductor structures.

Palladium may be present in multilayer ceramic capacitors distributed across the motherboard.

Tin and nickel are found in solder alloys, component leads, socket underplating, connector plating, rear I/O shielding, and plated contact surfaces.

Aluminum may be recovered from heatsinks if present, but heatsinks do not define the circuit-board grade. Large mechanical accessories should be removed when practical, while electronic components should remain attached.

Buying Standards

A preferred D Grade IPISB-CU (Carmel2) motherboard should have:

  • Compatible LGA1155 CPU installed when CPU-included material is required.

  • LGA1155 socket intact.

  • Intel H61 chipset package present.

  • Two DDR3 DIMM sockets present.

  • PCI Express x16 and PCI Express x1 slots present.

  • PCI Express Mini Card slot present where configured.

  • SATA connectors present.

  • BIOS flash present.

  • Realtek audio and LAN controller sections intact.

  • Rear USB, LAN, DVI-D, VGA, and audio connectors present.

  • ATX main power and CPU power connectors present.

  • Front-panel, fan, USB, S/PDIF, and recovery headers present.

  • PCB structurally complete.

  • Board dry and reasonably clean.

  • No severe corrosion.

  • No burn damage.

  • No water damage.

  • No battery leakage.

  • No heavy component harvesting.

  • No oil, adhesive, paint, chemical residue, excessive thermal paste, or heavy dust contamination.

  • No mixed low-grade material attached to the motherboard lot.

Functionality is not required for recycling. The board does not need to boot. Its value depends on physical material content, CPU presence, component completeness, connector condition, and contamination level.

Importance of CPU Completeness

The CPU should remain installed whenever the board is purchased as desktop motherboard with CPU material. The compatible CPU package is Intel LGA1155, 37.5 mm × 37.5 mm.

A CPU-installed board is more valuable because the processor contributes recoverable semiconductor material, package substrate, internal metal layers, contact lands, heat-spreader metal, and precious-metal-bearing structures. If the CPU is missing, the board remains D Grade motherboard scrap but should be purchased at a lower value. If the LGA1155 socket is damaged or removed, the downgrade is more severe because the board loses the socket contact field as well.

Keeping the CPU installed improves value within D Grade. It does not raise the board into C Grade, B Grade, A Grade, or A+ Grade because the board remains a modern Intel i-series metal-socket desktop motherboard under Ohata’s internal standard.

Acceptable Removals

The following removals usually do not change the D Grade identity if permanent electronics remain attached:

  • CPU heatsink.

  • CPU cooling fan.

  • Chipset heatsink, if the chipset remains undamaged.

  • Loose DDR3 memory modules.

  • Loose PCI Express graphics card.

  • Loose PCI Express Mini Card module.

  • I/O shield.

  • Case screws and brackets.

  • External cables.

  • Plastic case parts.

  • Non-electronic accessories.

The detailed D Grade standard allows removal of non-electronic accessories such as heatsinks, cooling fans, brackets, plastic housings, and loose cables, while processors, chipsets, sockets, connectors, and voltage-regulation circuits should remain attached because they contribute directly to recoverable value.

Conditions That Reduce Value

HP Pegatron IPISB CU (Carmel2) Motherboard Conditions That Reduce Value
HP Pegatron IPISB CU (Carmel2) Motherboard Conditions That Reduce Value

The following conditions reduce buying value:

  • CPU missing when CPU-installed boards are expected.

  • LGA1155 socket contacts bent or broken.

  • CPU socket removed.

  • Intel H61 chipset removed or damaged.

  • DDR3 slots removed or cracked.

  • PCI Express slots harvested.

  • SATA connectors removed.

  • BIOS chip removed.

  • LAN or audio controller sections harvested.

  • Rear I/O ports broken or missing.

  • ATX power connector removed.

  • PCB cracked, drilled, cut, snapped, or missing sections.

  • Coin-cell battery leakage.

  • Heavy oxidation or corrosion.

  • Burned or carbonized PCB areas.

  • Water damage or PCB delamination.

  • Oil, adhesive, paint, chemical residue, excessive thermal paste, or heavy dirt contamination.

  • Mixed loads containing appliance boards, wire, batteries, plastic, steel, power-supply boards, or unrelated scrap.

The D Grade standard notes that missing processors, removed chipsets, broken PCB sections, heavy corrosion, burn damage, water intrusion, battery leakage, oil contamination, and large cut sections may reduce grade or buying value.

Rejection Conditions

A board may be rejected from sorted D Grade motherboard buying or moved to a lower mixed-PCB category when the expected recoverable structure cannot be inspected. Severe rejection or downgrade conditions include:

  • Board cut into multiple pieces.

  • CPU socket removed.

  • Main chipset package removed.

  • Heavy IC harvesting.

  • Severe fire damage.

  • Severe corrosion across the CPU, memory, chipset, or expansion areas.

  • PCB swelling or delamination from water damage.

  • Battery leakage destroying traces.

  • Heavy chemical contamination.

  • Mixed trash load where the motherboard cannot be separated.

A clean, complete, CPU-installed HP / Pegatron IPISB-CU (Carmel2) is D Grade Board Scrap. A stripped, CPU-missing, broken, corroded, contaminated, or mixed board has lower value.

Handling and Storage

Store the motherboard flat, dry, and separated from heavy scrap. Do not crush it under power supplies, transformers, motors, steel, batteries, or mixed e-waste. Moisture should be avoided because it attacks LGA1155 socket contacts, DDR3 contacts, PCI Express contacts, SATA contacts, USB contacts, LAN contacts, solder joints, chipset pads, and exposed copper.

CPU-installed boards should be separated from CPU-missing boards. D Grade desktop motherboards should be separated from B Grade desktop boards, C Grade standard boards, A Grade laptop boards, A+ Apple logic boards, appliance boards, power-supply boards, batteries, wires, plastics, and mixed low-grade material. Proper sorting protects value and prevents an otherwise acceptable board from being averaged down in a mixed lot.

Comparison, and Official Ohata Classification

Comparison with Laptop Motherboards

Laptop motherboards usually use SO-DIMM slots, flat-flex display connectors, battery charging circuits, compact BGA packages, and irregular notebook shapes. Non-Apple laptop motherboards are generally A Grade under Ohata because of compact multilayer construction and higher component density. The IPISB-CU is a desktop motherboard with full-size DDR3 DIMM sockets, PCI Express slots, ATX-style power connectors, SATA connectors, and rear desktop I/O, so it should not be sorted as laptop motherboard material.

Comparison with Apple Logic Boards

Apple logic boards are typically A+ Grade because they have dense semiconductor coverage, compact proprietary layouts, BGA processor packages, fine-pitch connectors, and premium multilayer construction. The IPISB-CU is an HP / Pegatron desktop board and must not be mixed with Apple logic-board scrap.

Comparison with B Grade Boards

B Grade boards include medium-grade boards with better component density, stronger connector value, or medium-value CPU socket designs, as well as some lower-grade telecom, embedded, and server-type boards. The IPISB-CU has a modern LGA1155 i-series metal socket, but Ohata’s Board Grade Class specifically places this socket style and later Intel desktop platform type in D Grade.

Comparison with C Grade Boards

C Grade boards include standard desktop motherboards, graphics cards, trimmed expansion cards, and interface cards with moderate recoverable value. The IPISB-CU is a complete desktop board, but it is a later consumer i-series motherboard with integrated platform architecture, limited support-chip density, and a metal socket cover/lever. The D Grade standard is the more accurate Ohata classification.

Comparison with Appliance Boards

Appliance boards are designed for motors, relays, compressors, pumps, heaters, sensors, and appliance user interfaces. The IPISB-CU is a digital computing board with CPU socket, DDR3 memory, PCI Express expansion, Intel H61 chipset, BIOS, SATA, USB, LAN, audio, VGA, DVI-D, and ATX-style power architecture. It should not be sorted as Appliance Board A or Appliance Board B.

Official Ohata Classification Claim

The HP / Pegatron IPISB-CU (Carmel2) Intel H61 LGA1155 desktop motherboard is classified as:

Ohata Board Scrap Classification: D Grade Board Scrap

This classification is based on the following confirmed characteristics:

  • Desktop computer motherboard.

  • HP / Pegatron IPISB-CU board family.

  • HP/Compaq Carmel2 platform name.

  • HP assembly/service part family including 644016-001 / 656846-001 / 656846-002 depending on revision.

  • Micro-ATX 24.4 cm × 24.4 cm form factor.

  • Intel LGA1155 / Socket H2 CPU interface.

  • Metal CPU socket load plate and lever.

  • 37.5 mm × 37.5 mm compatible CPU package size.

  • Assumed compatible LGA1155 CPU installed.

  • Intel H61 chipset.

  • Integrated processor/platform graphics output through VGA and DVI-D.

  • Two 240-pin DDR3 DIMM sockets.

  • PC3-8500 1066 MHz and PC3-10600 1333 MHz DDR3 support.

  • One PCI Express x16 slot.

  • Three PCI Express x1 slots.

  • One PCI Express Mini Card x1 slot.

  • Four SATA 2.0 connectors.

  • Realtek ALC656 / ALC656GR high-definition audio.

  • RTL8171EH-CG Gigabit Ethernet.

  • Rear USB, LAN, DVI-D, D-Sub/VGA, and analog audio I/O.

  • ATX power connector and ATX CPU power connector.

  • Front-panel, front-audio, USB, S/PDIF, ROM recovery, hood-sense, one-touch reset, and one-touch recovery connectors.

  • Cost-efficient modern Intel i-series OEM desktop motherboard construction.

  • D Grade metal-socket desktop motherboard characteristics under Ohata guidance.

  • Recoverable copper, CPU socket contacts, memory connector contacts, PCI Express contacts, IC bond-wire material, solder, nickel-plated connectors, MLCC-related palladium, and limited gold-bearing contact surfaces.

The D Grade classification assumes that the motherboard is complete, clean, dry, structurally intact, and includes the CPU. If the CPU is missing, the Intel H61 chipset is removed, the LGA1155 socket is damaged, major connectors are harvested, the PCB is cracked, or the board is corroded, burned, water damaged, chemically contaminated, or mixed with miscellaneous scrap, the buying value may be reduced or the board may be rejected from the sorted D Grade motherboard category.

The Ohata Board Scrap Classification System is an internal Ohata value-identification and sorting method for electronic scrap purchasing, warehouse grading, and recycling education. It is not an international standard, government regulation, ISO standard, or universally accepted industry classification. Final grade depends on physical inspection, CPU presence, board completeness, contamination level, and actual recoverable material condition.

Ohata MotherBoard Scrap Wiki Claim

The Ohata Wiki is an educational knowledge base developed and maintained by Ohata to provide information on electronic scrap identification, recycling technologies, material classification, and sustainable resource recovery. The content published in the Ohata Wiki is based on Ohata's operational experience, research, and educational objectives. It is intended to assist recyclers, businesses, researchers, students, and the public in understanding electronic materials and recycling practices.

The Ohata Wiki is designed as an educational reference only. It does not replace professional technical advice, engineering analysis, laboratory testing, or official industry standards.

Ohata MotherBoard Classification Claim

The Ohata MotherBoard Classification System is a proprietary educational classification created by Ohata based on the company's internal recycling knowledge and operational experience. It is intended solely for educational and identification purposes. It is not an international standard, government specification, or universally accepted industry grading system. Classification methods, purchasing requirements, and recycling practices may differ among companies, regions, and markets.

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Record the assembly number, system product number, installed CPU, socket condition and missing OEM hardware before grading. Test complete boards for HP repair value first; if recycling is appropriate, apply the current D Grade conditions and use the live price link.

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Author: Ohata.Ai Wiki Editorial Team

The Ohata Ai Editorial Team creates accurate, practical, and educational content about electronic scrap, circuit board identification, recycling standards, AI-powered data analysis, and market-based purchasing information.

Working with industry specialists, data analysts, and technology professionals, the team reviews technical details, improves content quality, and publishes clear knowledge for customers, businesses, and recycling professionals.

Its goal is to make e-scrap information easier to understand, more transparent, and more useful.

FAQ
1. What is the exact board identity?
The board is best identified as HP / Pegatron IPISB-CU (Carmel2), with HP assembly/service part family 644016-001 / 656846-001 / 656846-002 depending on revision. The IPISB-CU / Carmel2 specification lists HP brand, Pegatron manufacturer, Intel H61 chipset, LGA1155 socket, DDR3 memory, and Micro-ATX form factor.
2. Is this a desktop motherboard or laptop motherboard?
It is a desktop motherboard. It has full-size DDR3 DIMM sockets, a desktop Intel LGA1155 CPU socket, PCI Express expansion slots, ATX power connectors, SATA connectors, and rear desktop I/O.
3. What CPU socket does it use?
It uses Intel LGA1155 / Socket H2. The IPISB-CU specification lists socket type as LGA 1155. The compatible LGA1155 CPU package is 37.5 mm × 37.5 mm. Intel’s LGA1155 Core i5-2500 specification lists package size as 37.5 mm x 37.5 mm.
4. Does the board contain a separate graphics card?
No. The board has integrated platform graphics output through VGA and DVI-D, but a separate graphics card, if installed, should be removed and sorted separately.
5. What is the official Ohata grade?
The official grade is Ohata D Grade Board Scrap, assuming a compatible CPU is installed and the motherboard remains complete.
6. Why is it D Grade instead of C Grade?
Ohata D Grade specifically includes i-series motherboards with metal CPU socket cover and lever designs, desktop motherboards with metal sockets, integrated desktop boards, and lower-value modern computer boards. The IPISB-CU matches those conditions.
7. Can this board be accepted without the CPU?
Yes, but it is worth less. If a buying category requires “motherboard with CPU,” a CPU-missing board may be priced separately, downgraded, or rejected from that specific category.
8. Which parts should remain attached for best value?
The CPU, LGA1155 socket, Intel H61 chipset, DDR3 slots, PCI Express slots, PCI Express Mini Card slot, SATA connectors, BIOS chip, audio/LAN sections, rear I/O, ATX power connector, and VRM components should remain attached.
9. Is a missing heatsink acceptable?
Usually yes. CPU heatsinks, fans, brackets, and loose cables can be removed if the CPU, socket, chipset, connectors, and permanent electronic components remain intact.
10. Should RAM modules and graphics cards stay attached?
No. Loose RAM modules and graphics cards should normally be sorted separately. The motherboard should retain its DIMM sockets and PCI Express slots.
11. Is the Ohata grade an international standard?
No. The Ohata classification is an internal value-sorting reference for Ohata purchasing, warehouse grading, and recycling education. It is not an international, ISO, government, or universal industry standard.

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